Lapping > 공정소개

BETTER TOGETHER
CHALLENGE
WAFERFAB

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Process - Detail page

Process

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작성자 최고관리자
댓글 0건 조회 9,929회 작성일 19-10-23 15:08

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Double Side

Lapping :: Wafer 및 Substrate의 고평탄도를 요구 시 양면설비의 상햐정반의 회전비 및 압력, 연마제 공급의 최적화로 기판의 고정밀, 고품질 연마하는 공정.
( Silicon, Glass, Quart, SiC, Shapphire, Ceramic etc )

이전글Grinding 19.10.23
다음글Edge grinding 19.10.23

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65, Gunpocheomdansaneop 2-ro, Gunpo-si, Gyeonggi-do, Republic of Korea / Tel: 031-454-7751 / fax: 031-454-7752 / E-mail: waferfab@waferfab.co.kr